ETSP-BTC series are Semiconductor Monitoring Burn-In test chambers to stress semiconductor packaged devices to ensure optimum performance as well as to weed out defective semiconductor packaged devices which can cause reliability problems in the end product.

General Features

  • Uniform high accurate and reliable temperature control
  • Easy of operation and simplicity
  • Friendly, flexible, up-to date control and management systems
  • Allows easy servicing and upgrades
  • Selectable between manual door type (BTC 1000) and automatic door type (BTC 2000)
  • Computer control is available
  • Network connection of several chambers to a single “master” control unit allowing centralized supervision both in local and remote mode
Technical Features
Temperature range 40 ℃ ~ 150 ℃ (changeable according to user’s demand)
Temperature uniformity Less than ± 0.5 ℃
Temperature rising time RT to 125 ℃ less than 50 minutes
Temperature cooling time 125 ℃ to RT less than 50 minutes
Cool own rate More than 1~5 ℃/min
Input power requirements 230V ±10%, 380V ±10%, 50Hz/60Hz, 1Ph/3Ph
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Technical Specifications
Model Internal dimensions External dimensions Note
ETSP-BTC 1000 1250x650x1300 (WxDxH) mm 2250x1500x2500 (WxDxH) mm Manual door
ETSP-BTC 2000 1250x1500x2500 (WxDxH) mm 1250x650x1300 (WxDxH) mm Automatic door
  • Controller : Touch screen LCD programmable type (6,000step, 300 profile)
  • No. of zones : 1
  • No. of slots for BIB (Burn in Board) : 48 (In case of BIB size is 450x571x1.6t (WxD mm) )
  • Refrigeration : cooling system for refrigeration or fresh air or cooled water
  • Inside material : STS304, 1.2t, polishing
  • Exterior material : CR 2.0t, painting
  • Safety devices : Switch-off after alarm for Overheating, Current leak, Over current, Door open (ELB, BKM, OHP, E-Stop Switch, Tower lamp)
Options
  • Chart recorder
  • T/C (Thermal couple) data acquisition (8, 16, 24, 32 Ch)
  • Chamber networking connection system (RS422/RS485)
  • Customization available
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